Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT
Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device
Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device
Leone, Federico, Fulvio Viviani, Hidetoshi Seki, and Masami Ishii. 2024. “Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device.” IMAPSource Proceedings 2023 (EMPC): 232–35. https://doi.org/10.4071/001c.94760.