Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device

Federico Leone; Fulvio Viviani; Hidetoshi Seki; Masami Ishii

doi:10.4071/001c.94760

Leone, Federico, Fulvio Viviani, Hidetoshi Seki, and Masami Ishii. 2024. “Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device.” IMAPSource Proceedings 2023 (EMPC): 232–35. https://doi.org/10.4071/001c.94760.

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