Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:39802/feed
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT

Initial Life Test of Silicone Encapsulated FR 4 Printed Circuit Boards for Pre-Clinical Active Implants

Henry T. Lancashire, Ishpa Ali, Fei Xue, Carlos Perez Henriquez, Thomas Niederhoffer, Ahmad Shah Idil, Dai Jiang,
life testencapsulationprinted circuit boardimpedancesolderFR4
https://doi.org/10.4071/001c.94758
IMAPSource Conference Papers
Lancashire, Henry T., Ishpa Ali, Fei Xue, Carlos Perez Henriquez, Thomas Niederhoffer, Ahmad Shah Idil, and Dai Jiang. 2024. “Initial Life Test of Silicone Encapsulated FR 4 Printed Circuit Boards for Pre-Clinical Active Implants.” IMAPSource Proceedings 2023 (EMPC): 224–27. https:/​/​doi.org/​10.4071/​001c.94758.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system