Initial Life Test of Silicone Encapsulated FR 4 Printed Circuit Boards for Pre-Clinical Active Implants

Henry T. Lancashire; Ishpa Ali; Fei Xue; Carlos Perez Henriquez; Thomas Niederhoffer; Ahmad Shah Idil; Dai Jiang

doi:10.4071/001c.94758

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Lancashire, Henry T., Ishpa Ali, Fei Xue, Carlos Perez Henriquez, Thomas Niederhoffer, Ahmad Shah Idil, and Dai Jiang. 2024. “Initial Life Test of Silicone Encapsulated FR 4 Printed Circuit Boards for Pre-Clinical Active Implants.” IMAPSource Proceedings 2023 (EMPC): 224–27. https://doi.org/10.4071/001c.94758.

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