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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT

Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application

Hiren R. Kotadia, Juan Ignacio Ahuir-Torres, Sri Krishna Bhogaraju, Geoff West, Gordon Elger,
Copper sinteringhigh-temperature electronicscorrosionporosityelectrochemical analysis
https://doi.org/10.4071/001c.94752
IMAPSource Conference Papers
Kotadia, Hiren R., Juan Ignacio Ahuir-Torres, Sri Krishna Bhogaraju, Geoff West, and Gordon Elger. 2024. “Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application.” IMAPSource Proceedings 2023 (EMPC): 211–15. https:/​/​doi.org/​10.4071/​001c.94752.
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