ISSN 2380-4505
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT
Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages
Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages
Klengel, Sandy, Robert Klengel, and Tino Stephan. 2024. “Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages.” IMAPSource Proceedings 2023 (EMPC): 201–5. https://doi.org/10.4071/001c.94750.