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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT

Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Sandy Klengel, Robert Klengel, Tino Stephan,
high resolution analysesmicrostructurelaser preparationion beam preparationreliability assessmentelectronic packaging
https://doi.org/10.4071/001c.94750
IMAPSource Conference Papers
Klengel, Sandy, Robert Klengel, and Tino Stephan. 2024. “Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages.” IMAPSource Proceedings 2023 (EMPC): 201–5. https:/​/​doi.org/​10.4071/​001c.94750.
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