Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Sandy Klengel; Robert Klengel; Tino Stephan

doi:10.4071/001c.94750

Klengel, Sandy, Robert Klengel, and Tino Stephan. 2024. “Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages.” IMAPSource Proceedings 2023 (EMPC): 201–5. https://doi.org/10.4071/001c.94750.

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Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

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