ISSN 2380-4505
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT
Silver Bonding Wire - an Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging
Silver Bonding Wire - an Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging
Robert Klengel, Sandy Klengel, Sebastian Tismer, Noritoshi Araki, Motoki Eto, Teruo Haibara, Takashi Yamada, Jochen Feldmann, Achim Scheer, Ralph Binner, Henk Peters,
Klengel, Robert, Sandy Klengel, Sebastian Tismer, Noritoshi Araki, Motoki Eto, Teruo Haibara, Takashi Yamada, et al. 2024. “Silver Bonding Wire - an Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging.” IMAPSource Proceedings 2023 (EMPC): 195–200. https://doi.org/10.4071/001c.94749.