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ISSN 2380-4505
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT

Evaluation of the Environmental Impact within Semiconductor Packaging Materials

Jeff Kettle, Andrew Bainbridge, Kathleen Grant, Lewis Clark,
LCAdegradable electronicsadditive printingPCB
https://doi.org/10.4071/001c.94747
IMAPSource Conference Papers
Kettle, Jeff, Andrew Bainbridge, Kathleen Grant, and Lewis Clark. 2024. “Evaluation of the Environmental Impact within Semiconductor Packaging Materials.” IMAPSource Proceedings 2023 (EMPC): 185–88. https:/​/​doi.org/​10.4071/​001c.94747.

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