Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang, Ki-Seok, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jin-Hyuk Oh, Chan-Mi Lee, Yoon-Hwan Moon, Seok-Hwan Moon, and Kwang-Seong Choi. 2024. “Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process.” IMAPSource Proceedings 2023 (EMPC): 171–74. https://doi.org/10.4071/001c.94707.