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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT

Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process

Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jin-Hyuk Oh, Chan-Mi Lee, Yoon-Hwan Moon, Seok-Hwan Moon, Kwang-Seong Choi,
Anisotropic Solder Paste (ASP)Anisotropic Conductive Film (ACF)Laser Assisted Bonding (LAB)mini LED
https://doi.org/10.4071/001c.94707
IMAPSource Conference Papers
Jang, Ki-Seok, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jin-Hyuk Oh, Chan-Mi Lee, Yoon-Hwan Moon, Seok-Hwan Moon, and Kwang-Seong Choi. 2024. “Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process.” IMAPSource Proceedings 2023 (EMPC): 171–74. https:/​/​doi.org/​10.4071/​001c.94707.
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