Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres
Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres
Huynh, Van Long, Knut E. Aasmundtveit, and Hoang-Vu Nguyen. 2024. “Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres.” IMAPSource Proceedings 2023 (EMPC): 161–65. https://doi.org/10.4071/001c.94704.