Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Durability of Lead-Free Solder Interconnections for Printed Circuit Board Applications: Comparing Energy-Based Thermo-Mechanical Fatigue Models
Durability of Lead-Free Solder Interconnections for Printed Circuit Board Applications: Comparing Energy-Based Thermo-Mechanical Fatigue Models
Huang, Chien-Ming, and Jeffrey W. Herrmann. 2024. “Durability of Lead-Free Solder Interconnections for Printed Circuit Board Applications: Comparing Energy-Based Thermo-Mechanical Fatigue Models.” IMAPSource Proceedings 2023 (EMPC): 155–60. https://doi.org/10.4071/001c.94703.