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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT

Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications

Ming-Che Hsieh, Frank Zhang, Forest Zhu, Kang Liu, Linda Chua, Yaojian Lin, Joel A. Damalerio, Hin Hwa Goh, Kai Chong Chan, Zihao Chen,
Fan-out wafer level packageFOWLPeWLBantenna in packageAiP77GHzautomotive
https://doi.org/10.4071/001c.94701
IMAPSource Conference Papers
Hsieh, Ming-Che, Frank Zhang, Forest Zhu, Kang Liu, Linda Chua, Yaojian Lin, Joel A. Damalerio, Hin Hwa Goh, Kai Chong Chan, and Zihao Chen. 2024. “Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications.” IMAPSource Proceedings 2023 (EMPC): 145–49. https:/​/​doi.org/​10.4071/​001c.94701.
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