Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications
Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications
Hsieh, Ming-Che, Frank Zhang, Forest Zhu, Kang Liu, Linda Chua, Yaojian Lin, Joel A. Damalerio, Hin Hwa Goh, Kai Chong Chan, and Zihao Chen. 2024. “Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications.” IMAPSource Proceedings 2023 (EMPC): 145–49. https://doi.org/10.4071/001c.94701.