Testing of Electromigration Resistance of Copper and Silver Thick Films

Jiri Hlina; Jan Reboun; Marek Simonovsky; Ales Hamacek

doi:10.4071/001c.94700

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Hlina, Jiri, Jan Reboun, Marek Simonovsky, and Ales Hamacek. 2024. “Testing of Electromigration Resistance of Copper and Silver Thick Films.” IMAPSource Proceedings 2023 (EMPC): 140–44. https://doi.org/10.4071/001c.94700.

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