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ISSN 2380-4505
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT

Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Martin Hirman, Jiri Navrátil, Andrea Benesová, Frantisek Steiner,
e-wasteSMD chip components reusee-textilesnon-conductive adhesiverecycling
https://doi.org/10.4071/001c.94699
IMAPSource Conference Papers
Hirman, Martin, Jiri Navrátil, Andrea Benesová, and Frantisek Steiner. 2024. “Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles.” IMAPSource Proceedings 2023 (EMPC): 135–39. https:/​/​doi.org/​10.4071/​001c.94699.

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