Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Hecht, Christoph, Eric Schadow, Mario Sprenger, Felix Haeussler, Thomas Stoll, and Joerg Franke. 2024. “Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications.” IMAPSource Proceedings 2023 (EMPC): 129–34. https://doi.org/10.4071/001c.94698.