Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder
Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder
Harvey, David M., Teresa Partida Manzanera, Kangkana Baishya, Guangming Zhang, Mohd Arif Anuar Mohd Salleh Arif, Y. C. Chan, Nduka Ekere, and Derek Braden. 2024. “Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder.” IMAPSource Proceedings 2023 (EMPC): 119–22. https://doi.org/10.4071/001c.94696.