Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
Gougeon, Julie, Jean-Charles Souriau, Laurent Mendizabal, Céline Feautrier, Rémi Franiatte, Mona Tréguer-Delapierre, and Edouard Deschaseaux. 2024. “Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering.” IMAPSource Proceedings 2023 (EMPC): 111–14. https://doi.org/10.4071/001c.94692.