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ISSN 2380-4505
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT

Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology

Yong-Sung Eom, Gwang-Mun Choi, Ki-Seok Jang, Ji-Ho Joo, Chan-Mi Lee, Jin-Heuk Oh, Seok-Hwan Moon, Kwang-Seong Choi,
simultaneous transfer and bondingprocess windowroom temperature pot life (RPL)stage pot life I(SPL)laser pot life (LPL)mini LED
https://doi.org/10.4071/001c.94690
IMAPSource Conference Papers
Eom, Yong-Sung, Gwang-Mun Choi, Ki-Seok Jang, Ji-Ho Joo, Chan-Mi Lee, Jin-Heuk Oh, Seok-Hwan Moon, and Kwang-Seong Choi. 2024. “Process Window of Mini-LED Display Panel Packaging Using Laser Assisted Bonding Technology.” IMAPSource Proceedings 2023 (EMPC): 107–10. https:/​/​doi.org/​10.4071/​001c.94690.

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