Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames

Ruud de Wit; Henry Martin; Xinpei Cao; Jan Wijgaerts; Edsger Smits; Bo Xia

doi:10.4071/001c.94684

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Wit, Ruud de, Henry Martin, Xinpei Cao, Jan Wijgaerts, Edsger Smits, and Bo Xia. 2024. “Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames.” IMAPSource Proceedings 2023 (EMPC): 72–79. https://doi.org/10.4071/001c.94684.

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