Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
Wit, Ruud de, Henry Martin, Xinpei Cao, Jan Wijgaerts, Edsger Smits, and Bo Xia. 2024. “Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames.” IMAPSource Proceedings 2023 (EMPC): 72–79. https://doi.org/10.4071/001c.94684.