Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
I. Cirulis, U. Zschenderlein, S. Braun, M. Radestock, R. Pantou, K. Vogel, F. Selbmann, S. Kurth, B. Wunderle, H. Kuhn,
Cirulis, I., U. Zschenderlein, S. Braun, M. Radestock, R. Pantou, K. Vogel, F. Selbmann, S. Kurth, B. Wunderle, and H. Kuhn. 2024. “Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration.” IMAPSource Proceedings 2023 (EMPC): 61–65. https://doi.org/10.4071/001c.94682.