Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Chernobryvko, Mykola, Michael P. Kaiser, Kavin Senthil Murugesan, Dan Kuylenstierna, Julia-Marie Köszegi, Robert Gernhardt, Tanja Braun, Ivan Ndip, and Martin Schneider-Ramelow. 2024. “High-Q Ku-Band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications.” IMAPSource Proceedings 2023 (EMPC): 57–60. https://doi.org/10.4071/001c.94653.