ISSN 2380-4505
Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT
Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate
Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate
Chen, Chuantong, Ran Liu, Koji Kobayashi, Hideyo Osanai, Zheng Zhang, and Katsuaki Suganuma. 2024. “Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate.” IMAPSource Proceedings 2023 (EMPC): 48–51. https://doi.org/10.4071/001c.94651.