Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate

Chen, Chuantong, Ran Liu, Koji Kobayashi, Hideyo Osanai, Zheng Zhang, and Katsuaki Suganuma. 2024. “Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate.” IMAPSource Proceedings 2023 (EMPC): 48–51. https://doi.org/10.4071/001c.94651.