Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:54963/feed
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT

UV Laser Copper Pad Surface Exposure for Laser Direct Structuring (LDS) of Interconnection

Guendalina Catalano, Alessandro Mellina Gottardo, Riccardo Villa,
LDS (laser direct structuring)DCI (direct copper interconnection)lasersemiconductor packages
https://doi.org/10.4071/001c.94650
IMAPSource Conference Papers
Catalano, Guendalina, Alessandro Mellina Gottardo, and Riccardo Villa. 2024. “UV Laser Copper Pad Surface Exposure for Laser Direct Structuring (LDS) of Interconnection.” IMAPSource Proceedings 2023 (EMPC): 42–47. https:/​/​doi.org/​10.4071/​001c.94650.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system