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ISSN 2380-4505
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT

Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors

Lars Böttcher, Andreas Ostmann, Thomas Löher, Manuel Seckel,
EmbeddingPCB technologySiC MOSFETPower module
https://doi.org/10.4071/001c.94647
IMAPSource Conference Papers
Böttcher, Lars, Andreas Ostmann, Thomas Löher, and Manuel Seckel. 2024. “Concepts for Realizing High-Voltage Power Modules by Embedding of SiC Semiconductors.” IMAPSource Proceedings 2023 (EMPC): 36–41. https:/​/​doi.org/​10.4071/​001c.94647.

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