Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:10836/feed
EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT

Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors

Lars Böttcher, Andreas Ostmann, Thomas Löher, Manuel Seckel,
EmbeddingPCB technologySiC MOSFETPower module
https://doi.org/10.4071/001c.94647
IMAPSource Conference Papers
Böttcher, Lars, Andreas Ostmann, Thomas Löher, and Manuel Seckel. 2024. “Concepts for Realizing High-Voltage Power Modules by Embedding of SiC Semiconductors.” IMAPSource Proceedings 2023 (EMPC): 36–41. https:/​/​doi.org/​10.4071/​001c.94647.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system