Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions

Sri Krishna Bhogaraju; Francesco Ugolini; Federico Belponer; Alessio Greci; Gordon Elger

doi:10.4071/001c.94645

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Bhogaraju, Sri Krishna, Francesco Ugolini, Federico Belponer, Alessio Greci, and Gordon Elger. 2024. “Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions.” IMAPSource Proceedings 2023 (EMPC): 25–29. https://doi.org/10.4071/001c.94645.

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