Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT
Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors
Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors
Behrmann, Ole, Thomas Lisec, Finn Klingbeil, Niklas Kyoushi, and Björn Gojdka. 2024. “Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors.” IMAPSource Proceedings 2023 (EMPC): 21–24. https://doi.org/10.4071/001c.94638.