Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors

Ole Behrmann; Thomas Lisec; Finn Klingbeil; Niklas Kyoushi; Björn Gojdka

doi:10.4071/001c.94638

Behrmann, Ole, Thomas Lisec, Finn Klingbeil, Niklas Kyoushi, and Björn Gojdka. 2024. “Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors.” IMAPSource Proceedings 2023 (EMPC): 21–24. https://doi.org/10.4071/001c.94638.

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Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors

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