Vol. 2023, Issue EMPC, 2023March 04, 2024 EDT
A High-Density Organic Package Solution to W-band SiGe Flip-Chip Applications
A High-Density Organic Package Solution to W-band SiGe Flip-Chip Applications
Altuntas, Firat, Nihan Oznazli, Olcay Kalkan, and Emrah Koc. 2024. “A High-Density Organic Package Solution to W-Band SiGe Flip-Chip Applications.” IMAPSource Proceedings 2023 (EMPC): 6–9. https://doi.org/10.4071/001c.94634.