Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:53517/feed
Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT

Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted Adhesion

Soojae Park, Hwajin Jeong, Sichun Seo, Chulhyung Cho,
Adhesively-Promoted WireAl2O3 CoatingBonding WireInsulated WireNano CeramicPassivated Wire
https://doi.org/10.4071/001c.94525
IMAPSource Conference Papers
Park, Soojae, Hwajin Jeong, Sichun Seo, and Chulhyung Cho. 2024. “Al2O3-Coated Bonding Wire with Electrical Insulation & Promoted Adhesion.” IMAPSource Proceedings 2023 (Symposium): 315–19. https:/​/​doi.org/​10.4071/​001c.94525.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system