Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications
Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications
Griffith, Evan. 2024. “Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package Applications.” IMAPSource Proceedings 2023 (Symposium): 309–14. https://doi.org/10.4071/001c.94524.