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Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT

Gold Coated Silver Bonding Wire and Its Consistent Reliability Performances

Sarangapani Murali, Dhayalan Mariyappan, Tan Tze Qing, Loke Chee Keong, Balasubramanian Senthil Kumar, Kang Sungsig SS,
Bonding wirethermal aginghigh temperature storageepoxy molded devicebHASTuHAST
https://doi.org/10.4071/001c.94521
IMAPSource Conference Papers
Murali, Sarangapani, Dhayalan Mariyappan, Tan Tze Qing, Loke Chee Keong, Balasubramanian Senthil Kumar, and Kang Sungsig SS. 2024. “Gold Coated Silver Bonding Wire and Its Consistent Reliability Performances.” IMAPSource Proceedings 2023 (Symposium): 300–304. https:/​/​doi.org/​10.4071/​001c.94521.
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