ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging through Cryo-Argon Milling Technique
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging through Cryo-Argon Milling Technique
Razmyar, Soheil, Nicholas Lay, and Kaysar Rahim. 2024. “Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging through Cryo-Argon Milling Technique.” IMAPSource Proceedings 2023 (Symposium): 287–93. https://doi.org/10.4071/001c.94518.