Development of Wafer Level Package Platform for High Reliability Crossover MCUs

Gaurav Sharma; Meng Yao Su; Varun Thukral; Craig Beddingfield; Nishant Lakhera

doi:10.4071/001c.94511

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Sharma, Gaurav, Meng Yao Su, Varun Thukral, Craig Beddingfield, and Nishant Lakhera. 2024. “Development of Wafer Level Package Platform for High Reliability Crossover MCUs.” IMAPSource Proceedings 2023 (Symposium): 266–72. https://doi.org/10.4071/001c.94511.

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