Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Tiedje, Tobias, Christoph Bräuer, Marco Luniak, Krzysztof Nieweglowski, and Karlheinz Bock. 2024. “Stereolithographic Process for Embedding of Electronic Components into Multi-Material Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching.” IMAPSource Proceedings 2023 (Symposium): 234–38. https://doi.org/10.4071/001c.94502.