Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV Wafer

Naoya Watanabe; Hiroshi Yamamoto; Takahiko Mitsui

doi:10.4071/001c.94499

Watanabe, Naoya, Hiroshi Yamamoto, and Takahiko Mitsui. 2024. “Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-Middle TSV Wafer.” IMAPSource Proceedings 2023 (Symposium): 222–27. https://doi.org/10.4071/001c.94499.

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Impact of Cu Protrusion on Connection Resistance in Hybrid Bonding of Via-middle TSV Wafer

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