Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages
Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages
Hart, Martin. 2024. “Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages.” IMAPSource Proceedings 2023 (Symposium): 216–21. https://doi.org/10.4071/001c.94498.