ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials
Next Level of 1/1 μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials
Yu Shoji, Takuma Nishimura, Hisashi Ogasawara, Keika Hashimoto, Yuki Masuda, Hitoshi Araki, Masao Tomikawa,
Shoji, Yu, Takuma Nishimura, Hisashi Ogasawara, Keika Hashimoto, Yuki Masuda, Hitoshi Araki, and Masao Tomikawa. 2024. “Next Level of 1/1 Μm Line and Space Copper Redistribution Layer Fabrication with Organic Dielectric Materials.” IMAPSource Proceedings 2023 (Symposium): 190–94. https://doi.org/10.4071/001c.94492.