Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends
Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends
Evertsen, Rogier, Janet Hopkins, Oliver Ansell, Samira Kazemi, Roland Mumford, Richard Barnett, Kees Biesheuvel, and Jeroen van Borkulo. 2024. “Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends.” IMAPSource Proceedings 2023 (Symposium): 184–89. https://doi.org/10.4071/001c.94490.