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Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT

Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends

Rogier Evertsen, Janet Hopkins, Oliver Ansell, Samira Kazemi, Roland Mumford, Richard Barnett, Kees Biesheuvel, Jeroen van Borkulo,
Hybrid bondingdie strengthplasma dicingUV-USP laser grooving
https://doi.org/10.4071/001c.94490
IMAPSource Conference Papers
Evertsen, Rogier, Janet Hopkins, Oliver Ansell, Samira Kazemi, Roland Mumford, Richard Barnett, Kees Biesheuvel, and Jeroen van Borkulo. 2024. “Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends.” IMAPSource Proceedings 2023 (Symposium): 184–89. https:/​/​doi.org/​10.4071/​001c.94490.

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