Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Addressing Die Displacement in Lithography Processes for Advanced Packaging Applications
Addressing Die Displacement in Lithography Processes for Advanced Packaging Applications
Sylvain I. Misat, Jeroen de Boeij, Chia-Ching Huang, Peter van der Krieken, Mikhail Loktev, Yutai Lee, Michiel van der Stam,
Misat, Sylvain I., Jeroen de Boeij, Chia-Ching Huang, Peter van der Krieken, Mikhail Loktev, Yutai Lee, and Michiel van der Stam. 2024. “Addressing Die Displacement in Lithography Processes for Advanced Packaging Applications.” IMAPSource Proceedings 2023 (Symposium): 164–68. https://doi.org/10.4071/001c.94485.