Solder-less Fine Pitch Copper-to-Copper Bonding

Nicholas Lay; Kaysar Rahim

doi:10.4071/001c.94484

Lay, Nicholas, and Kaysar Rahim. 2024. “Solder-Less Fine Pitch Copper-to-Copper Bonding.” IMAPSource Proceedings 2023 (Symposium): 158–63. https://doi.org/10.4071/001c.94484.

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