Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding

Bex, Pieter, Alain Phommahaxay, Koen Kennes, Samuel Suhard, Steven Brems, and Eric Beyne. 2024. “Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding.” IMAPSource Proceedings 2023 (Symposium): 151–57. https:/​/​doi.org/​10.4071/​001c.94483.