Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding

Pieter Bex; Alain Phommahaxay; Koen Kennes; Samuel Suhard; Steven Brems; Eric Beyne

doi:10.4071/001c.94483

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Bex, Pieter, Alain Phommahaxay, Koen Kennes, Samuel Suhard, Steven Brems, and Eric Beyne. 2024. “Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding.” IMAPSource Proceedings 2023 (Symposium): 151–57. https://doi.org/10.4071/001c.94483.

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