Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann Method
Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann Method
Lee, Jung Shin, Sujie Kang, and Daniel Min Woo Rhee. 2024. “Numerical Analysis of Narrow-Gap Underfill Flow in the Flip-Chip Process Using the Lattice Boltzmann Method.” IMAPSource Proceedings 2023 (Symposium): 144–50. https://doi.org/10.4071/001c.94481.