A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices

Zhao, Yuan, Doug Katze, Ana Pre, Derek Wyatt, Josh Sherwood, and Jaskaran Virdi. 2024. “A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices.” IMAPSource Proceedings 2023 (Symposium): 139–43. https:/​/​doi.org/​10.4071/​001c.94480.