Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices
A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices
Zhao, Yuan, Doug Katze, Ana Pre, Derek Wyatt, Josh Sherwood, and Jaskaran Virdi. 2024. “A Thermally Enhanced Film Adhesive for Assembling High Power Density Electronic Devices.” IMAPSource Proceedings 2023 (Symposium): 139–43. https://doi.org/10.4071/001c.94480.