Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:57414/feed
Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT

Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability

Oliver Chyan, Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair,
Cu wire bonding failureCu-Al intermetallicsInterfacial Materials Chemistry ControlCu-selective passivation coating technology
https://doi.org/10.4071/001c.94475
IMAPSource Conference Papers
Chyan, Oliver, Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, and Shyam Nair. 2024. “Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability.” IMAPSource Proceedings 2023 (Symposium): 320–27. https:/​/​doi.org/​10.4071/​001c.94475.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system