Vol. 2023, Issue Symposium, 2023February 29, 2024 EDT
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability
Oliver Chyan, Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair,
Chyan, Oliver, Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, and Shyam Nair. 2024. “Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability.” IMAPSource Proceedings 2023 (Symposium): 320–27. https://doi.org/10.4071/001c.94475.