Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Development of Printed Circuit Boards with High Thermal Conductivity and Low Thermal Expansion by Applying Cu-Mo Composite Materials
Development of Printed Circuit Boards with High Thermal Conductivity and Low Thermal Expansion by Applying Cu-Mo Composite Materials
Ito, Yohei, Kenjiro Takanishi, Tatsuya Sakamoto, Keisuke Fujiwara, and Hitoshi Arai. 2024. “Development of Printed Circuit Boards with High Thermal Conductivity and Low Thermal Expansion by Applying Cu-Mo Composite Materials.” IMAPSource Proceedings 2023 (Symposium): 85–89. https://doi.org/10.4071/001c.94313.