Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives

Xuan Hong; Bo Xia; Vincent Pang; Lina Bian; Xinpei Cao; Noah Ekstrom; Juliet Sanchez; Edward Ho; Selene Hernandez; Qizhuo Zhuo; Rejoy Surendran

doi:10.4071/001c.94312

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Hong, Xuan, Bo Xia, Vincent Pang, Lina Bian, Xinpei Cao, Noah Ekstrom, Juliet Sanchez, et al. 2024. “Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives.” IMAPSource Proceedings 2023 (Symposium): 79–84. https://doi.org/10.4071/001c.94312.

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