Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
SiC Die Attach Based on Sintered for Wide Band Gap Semiconductor
SiC Die Attach Based on Sintered for Wide Band Gap Semiconductor
Kobori, Koyo. 2024. “SiC Die Attach Based on Sintered for Wide Band Gap Semiconductor.” IMAPSource Proceedings 2023 (Symposium): 75–78. https://doi.org/10.4071/001c.94311.