ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing Electronics
Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing Electronics
Guangyu Fan, Jeffrey Kurish, John Lamb, Jacob Wicher, Wakerley Banker, Alexander Bonacci, Sofia Tagliaferri, Kyle Green,
Fan, Guangyu, Jeffrey Kurish, John Lamb, Jacob Wicher, Wakerley Banker, Alexander Bonacci, Sofia Tagliaferri, and Kyle Green. 2024. “Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing Electronics.” IMAPSource Proceedings 2023 (Symposium): 65–74. https://doi.org/10.4071/001c.94310.