Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling

Huo, Fupeng, Ye Wang, Chuantong Chen, Zheng Zhang, Yoshiji Yamaguchi, Naoki Wakasugi, Aiji Suetake, and Katsuaki Suganuma. 2024. “Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling.” IMAPSource Proceedings 2023 (Symposium): 60–64. https://doi.org/10.4071/001c.94309.