Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling
Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling
Huo, Fupeng, Ye Wang, Chuantong Chen, Zheng Zhang, Yoshiji Yamaguchi, Naoki Wakasugi, Aiji Suetake, and Katsuaki Suganuma. 2024. “Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling.” IMAPSource Proceedings 2023 (Symposium): 60–64. https://doi.org/10.4071/001c.94309.