Cost Analysis of Fan-out Processes for Chiplet Packaging

Amy Palesko Lujan

doi:10.4071/001c.94301

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Lujan, Amy Palesko. 2024. “Cost Analysis of Fan-out Processes for Chiplet Packaging.” IMAPSource Proceedings 2023 (Symposium): 33–37. https://doi.org/10.4071/001c.94301.

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