Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
Ye, Pingping, Jianwen Han, Stephan Braye, Kyle Whitten, Veronica Hayes, Harshul Khanna, Adam Letize, Thomas Richardson, and Elie Najjar. 2024. “Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.” IMAPSource Proceedings 2023 (Symposium): 27–32. https://doi.org/10.4071/001c.94300.