Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:54963/feed
Symposium Proceedings
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT

The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch Interconnects

Fee Li Lie, Sathyanarayanan Raghavan, Eric Perfecto, Thomas Wassick, Conor Thomas, Heather Polgrean, Muthumanickam Sankarapandian, Cristina Estrada, Jennifer Oakley,
3D chiplet packagingFine pitchCPI modelingadvanced packagingassembly stressesAI corrosion
https://doi.org/10.4071/001c.94298
IMAPSource Conference Papers
Lie, Fee Li, Sathyanarayanan Raghavan, Eric Perfecto, Thomas Wassick, Conor Thomas, Heather Polgrean, Muthumanickam Sankarapandian, Cristina Estrada, and Jennifer Oakley. 2024. “The Impact of AI on Contact Resistance and Its Suitability in Fine Pitch Interconnects.” IMAPSource Proceedings 2023 (Symposium): 21–26. https:/​/​doi.org/​10.4071/​001c.94298.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system