Glass-Core Substrates for RF Heterogeneous Integrated Packages

Andrew Ketterson; Shuoqi Chen; Rajanish Pandey; Anthony Chiu; Lidia El Bouanani; John Hitt; Yanghun Yun; Yi Ram Kim; Kevin Anderson; Kirk Ashby

doi:10.4071/001c.94295

Ketterson, Andrew, Shuoqi Chen, Rajanish Pandey, Anthony Chiu, Lidia El Bouanani, John Hitt, Yanghun Yun, Yi Ram Kim, Kevin Anderson, and Kirk Ashby. 2024. “Glass-Core Substrates for RF Heterogeneous Integrated Packages.” IMAPSource Proceedings 2023 (Symposium): 9–13. https://doi.org/10.4071/001c.94295.

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Glass-Core Substrates for RF Heterogeneous Integrated Packages

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